Job Information
Texas Instruments Packaging Engineer in Kuala Lumpur, Malaysia
Description
We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.
As a member of our packaging team, you’ll have the chance to interact with many product groups and functions. You’ll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
Responsibilities may include:
Partnering with TI’s internal Power businesses to design and develop innovative power module packaging technologies, focused on miniaturization and integration:
Define and validate design rule roadmaps for multi-PCB power modules/sub-systems with vertical integration
Review and approve power module designs
Define and validate materials and process flows for these sub-systems
Define learning cycles and establish a robust assembly flow for new power modules
Guide the factory engineering team during qualification and production ramp of these sub-systems
Review assembly line quality and compliance
Lead discussions with customers on manufacturing and reliability aspects of power modules
Qualifications
Minimum requirements:
Bachelor's degree in Mechanical Engineering, Electrical Engineering or Materials Engineering
Minimum 10 years of relevant experience
Preferred qualifications:
Experience with:
packaging/assembly of power semiconductors
multi-PCB module assembly process
vertical integration of disparate components
reliability & manufacturability of electronic sub-systems/modules
directing materials & process flows in AT sites
mechanical & thermal modeling of power modules
Ability to establish strong relationships with key stakeholders critical to success, such as
sub-contractor and internal assembly sites
global design and manufacturing teams
component suppliers
Strong verbal and written communication skills
Working knowledge of engineering CAD tools
Why TI?
Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
We’re different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
About Texas Instruments
As a global semiconductor company, we design, manufacture, test and sell analog and embedded processing chips to nearly 100,000 customers. Our products enable electronics everywhere and in things you experience every day - from health care, smart homes and connected cars to drones, smart phones and more. Our passion to create a better and more sustainable world by making electronics more affordable through semiconductors drives us to make our technology smaller, more efficient, more reliable and more affordable.
Status Regular
Job: Engineering - Product Dev
Primary Location: MY-MY-Melaka
Other Locations: TW-TW-New Taipei City, PH-PH-Pampanga, PH-PH-Baguio City, MY-MY-Kuala Lumpur, JP-JP-Oita-Pref
Work Locations: Melaka > Malaysia, Melaka Melaka
Req ID: 240006ER