Texas Instruments MEMS / BEOL Integration Engineer in Dallas, Texas
We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.
As a member of our packaging team, you’ll have the chance to interact with many product groups and functions. You’ll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
Responsibilities may include:
Work in cross-functional teams, with circuit and system designers, research teams and product definers to create MEMs and Sensing technology roadmaps including assessing competitive approaches, vetting new technology, and proposing strategic investments and partnerships
Own all aspects of MEMS system integration
Demonstrate proof of concept through suppliers and foundry / university partners and transfer and ramp into HVM
Lead definition and validation of device requirements to meet program objectives
Complete detailed design and analysis of electro-magnetic, piezo-electric, and electrostatic drive MEMS devices used for sensing applications
Direct experimentation to test and validate performance and improve models
Develop assembly methods for MEMS devices and assist in the assembly process
Drive failure analysis to determine failure mode and corrective action to improve design and fabrication
PhD in MEMS/Mechanical/Electrical Engineering or related discipline
A minimum of 8 years’ experience in MEMS fabrication / 2.5D process development, integration and successful ramp to manufacturing
Expert knowledge of MEMS / BEOL Integration : design, materials, process integration and fabrication. Product validation, assembly procedures, failure analysis, and environmental test methods a strong plus.
Hands-on experience on photolithography, DRIE, release structures, plasma systems, thin film processing. Knowledge of graphene processing a strong plus
Experience working with broad range of suppliers and outside foundries to optimize processes and develop products from proof of concept to HVM
Broad technical understanding across multiple disciplines including : sensing applications (gas, resonator, magnetics), multi-physics modeling and design of MEMS sensors using FEA, hardware, software, controls, and reliability engineering.
Experience with SPC, PCM structures, and yield analysis.
Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
We’re different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.
About Texas Instruments
As a global semiconductor company, we design, manufacture, test and sell analog and embedded processing chips to nearly 100,000 customers. Our products enable electronics everywhere and in things you experience every day - from health care, smart homes and connected cars to drones, smart phones and more. Our passion to create a better and more sustainable world by making electronics more affordable through semiconductors drives us to make our technology smaller, more efficient, more reliable and more affordable.
Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws.
If you are interested in this position, please apply to this requisition.
Job: Engineering - Product Dev
Primary Location: US-TX-Dallas
Req ID: 22000BLL